Three-dimensional (3D) integration of various materials on top of bulk silicon could be the best answer for cost-effectively marrying optical devices with electronics. A*STAR researchers have used this approach to create a photodetector system for optical communications on a silicon chip.
Three-dimensional (3D) integration of various materials on top of bulk silicon could be the best answer for cost-effectively marrying optical devices with electronics. A*STAR researchers have used this approach to create a photodetector system for optical communications on a silicon chip.
Share this Article
Comment on this Article
Recommended
Please to comment