Tech Brief Describes the Best Eutectic Die-attach Method for MMICs in Hybrid Assemblies

Product Announcement SemiGen, Inc. has announced the publication of a new Tech Brief "Eutectic Die-Attach of GaN and GaAs MMICs." The latest in RF/microwave GaN and GaAs MMIC circuit chips (die) are providing higher power levels... Contributed Author: SemiGen, Inc. Topics: RF