Intel demos first Lakefield chip design using its 3D stacking architecture

Intel is making progress on developing its next-generation 10-nanometer processors, and today during its CES press conference, the chipmaker showed off the first completed designs for what the company is calling Lakefield. Based on the Foveros 3D design that was first outlined last month, Lakefield is effectively a stacked processor, similar to how chipmakers can now stack memory, that lets Intel break out different PC components into separate "chiplets" that rest on top of one another to create...