Henkel Expands BERGQUIST® GAP PAD® Portfolio with New Ultra-Low Modulus Thermal Interface Materials

Product Announcement Henkel Corporation today announced the addition of two ultra-low modulus BERGQUIST® GAP PAD® thermal interface materials (TIMs) to its line of high compliance thermal management products. BERGQUIST GAP PAD TGP 6000ULM and BERGQUIST GAP PAD TGP 7000ULM have been... Contributed Author: Henkel