Balluff's new wafer mapping sensor, BOH00EZ, uses a precise photoelectric sensor for quick and reliable detection of semiconductor wafers and slotting errors in FOUPS - front opening unified pods. Especially designed for use with extremely thin end effectors, it features a controlled and focused light spot, allowing it to detect wafers even just a few μm […] The post Balluff Wafer Mapping sensor for extremely thin end effectors appeared first on Electrical Engineering News and Products.
Balluff Wafer Mapping sensor for extremely thin end effectors
Medical Design Technology - 21 Jan 2020 18:11
Balluff's new wafer mapping sensor, BOH00EZ, uses a precise photoelectric sensor for quick and reliable detection of semiconductor wafers and slotting errors in FOUPS - front opening unified pods. Especially designed for use with extremely thin end effectors, it features a controlled and focused light spot, allowing it to detect wafers even just a few μm […] The post Balluff Wafer Mapping sensor for extremely thin end effectors appeared first on Electrical Engineering News and Products.
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