TE Connectivity (TE) has developed a minimal footprint SMI SO-10 pressure sensor package with vertical port, which is now in full production. Inside the housing, a MEMS pressure sensor, based on TE's proprietary silicon technology platform, and an advanced signal-conditioning IC are combined to provide a fully pressure calibrated and temperature compensated output. Covering gauge […] The post SMI pressure sensor package enables portable applications appeared first on Electrical Engineering New...
SMI pressure sensor package enables portable applications
Medical Design Technology - 28 May 2020 16:14
TE Connectivity (TE) has developed a minimal footprint SMI SO-10 pressure sensor package with vertical port, which is now in full production. Inside the housing, a MEMS pressure sensor, based on TE's proprietary silicon technology platform, and an advanced signal-conditioning IC are combined to provide a fully pressure calibrated and temperature compensated output. Covering gauge […] The post SMI pressure sensor package enables portable applications appeared first on Electrical Engineering New...
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